Product SMT
Semi Machine Transfer
The machine is semi-auto for loading leadframe to inspection quality of wire bond process. It’s hand free touch to leadframe to be make defect qualities with bonded device.
Product Specification:
| Semi Machine Transfer | |
| Accumulate Speed | 500 mm/s |
| Accumulate Resolution | +0.02 mm |
| Lead frame Position Accuracy | -1 mm |
| Applicable Lead frame | W-23-45 mm L-150-190 mm T-0.1-0.8 mm |
| Applicable Magazine | W-30-50 mm L-2000 mm (Standard) H-1200 mm (standard) |
| Device Changeover | < 4 minutes |
| Package Changeover | < 10 minutes |
